瓶胚高速注塑干燥系統(tǒng)之五，PET干燥機(jī)，PET瓶胚干燥，注塑干燥系統(tǒng)

五、瓶胚高速注塑專屬工藝參數(shù)
瓶胚高速注塑干燥系統(tǒng)的工藝參數(shù)需嚴(yán)格匹配瓶胚注塑的工藝特性，相比常規(guī) PET 干燥系統(tǒng)，在露點(diǎn)、干燥溫度、結(jié)晶度、干燥時(shí)間等核心參數(shù)上做了專項(xiàng)優(yōu)化，所有參數(shù)通過 PLC 實(shí)現(xiàn)閉環(huán)自動(dòng)調(diào)控，支持配方化管理，可一鍵切換 48/96/144/288 腔模具的適配參數(shù)。
The process parameters of the drying system for high-speed preform injection moulding need to strictly match the process characteristics of preform injection moulding. Compared with conventional PET drying systems, special optimizations have been made on core parameters such as dew point, drying temperature, crystallinity and drying time. All parameters realize closed-loop automatic regulation through PLC, support formula management, and can switch the adaptive parameters of 48/96/144/288 cavity moulds with one key.
核心工藝參數(shù)為送風(fēng)露點(diǎn)、干燥溫度、結(jié)晶度、干燥時(shí)間、熱風(fēng)風(fēng)速，各參數(shù)相互耦合，直接決定干燥品質(zhì)，針對(duì)瓶胚高速注塑的典型參數(shù)范圍與調(diào)控邏輯如下：
The core process parameters are supply air dew point, drying temperature, crystallinity, drying time and hot air speed, which are coupled with each other and directly determine the drying quality. The typical parameter range and regulation logic for high-speed preform injection moulding are as follows:
核心參數(shù) 瓶胚注塑專屬范圍 調(diào)控邏輯與工藝要求 英文對(duì)照
送風(fēng)露點(diǎn) -40℃~-70℃（優(yōu)選 - 50℃及以下） 瓶胚注塑需露點(diǎn)穩(wěn)定無波動(dòng)，露點(diǎn)＞-40℃易導(dǎo)致切片二次吸濕，醫(yī)藥級(jí)瓶胚需≤-60℃ Supply air dew point
干燥溫度 165~175℃（新料）/160~170℃（再生料） 溫度過高導(dǎo)致切片熱降解、瓶胚發(fā)黃；過低則干燥效率低，再生料需適當(dāng)降低溫度，避免分子鏈破損 Drying temperature
切片結(jié)晶度 25%~35%（精準(zhǔn)控溫 ±2%） ＜25% 易粘連，＞35% 增加干燥難度且瓶胚熔融不均，是瓶胚注塑的黃金結(jié)晶度區(qū)間 Chip crystallinity
干燥時(shí)間 4~5 小時(shí)（集成式）/5~6 小時(shí)（分體式） 匹配高速注塑連續(xù)供料，集成式因熱風(fēng)效率高，可適當(dāng)縮短干燥時(shí)間 Drying time
熱風(fēng)風(fēng)速 0.4~0.6m3/(min·kg) 保證熱風(fēng)穿透料層，均勻干燥，風(fēng)速過低干燥不均，過高則切片吹損、熱損耗增加 Hot air speed
料層厚度（干燥塔） 60~80cm 適配高速注塑的大產(chǎn)能，料層過厚熱風(fēng)穿透不足，過薄則產(chǎn)能低 Material layer thickness (drying tower)
輸送溫度 ≥150℃（全程保溫） 防止切片溫度降至 Tg 以下（70~80℃）導(dǎo)致吸濕，保證注塑熔融效率